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Notes main synth_tools/3D Printing/Pot_Knobs/Potentiometer Cap.STL Executable file View File resistor_keyboard.diy Executable file View File Hardware/Panel/precadsr_panel_al/precadsr_panel_al.pretty/Bigger_Push_Switch_Hole.kicad_mod Normal file View File Images/retrigger.png Normal file Unescape Hardware/PCB/precadsr/Kosmo_panel.pretty/fastestenv_Panel_Slotted_Mounting_Hole.kicad_mod Normal file View File Examples/EG_MANUAL.pdf Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/Jack_6.35mm_PJ_629HAN.kicad_mod Normal file Unescape Schematics/Unseen Servant/Unseen Servant.kicad_prl | 4 .../precadsr_panel_al.kicad_pcb | 2510 .../Bigger_Push_Switch_Hole_NPTH.kicad_mod | 17 .../Kosmo_LED_Hole_NPTH.kicad_mod | 17 .../PCB/precadsr_aux_Gerbers/precadsr-PTH.drl | 22 .../precadsr_aux_Gerbers/precadsr-job.gbrjob | 2 pin Molex header 2.54 mm spacing D 3 rotary switches with 3 faces. Cylinder(r = 8, h = shafthole_height, $fn = setscrew_hole_faces); // @todo Calculate the convexity values based on EPCOS app note at http://www.cypress.com/file/140006/download DFN, 6 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5353.pdf), generated with kicad-footprint-generator Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, AFC07-S24FCA-00, 24 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 6-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf DRT-3 1x0.8mm Pitch 0.7mm Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, area grid, YZR pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations.

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