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Panel thickness from printer realities Fix rail clearance issues, add PCB slot, more options for potentiometer spoke placement' (#1) from pcb_finalization into main ... Add notes about UX component wiring D36/R47 too close - Clock In - U1-13 (can get at from top when assembled Stop Switch - 10 ohms between U1-14 and U2-1 when off, more like 1M ohms when off - Single Step - 12V through 10k Ohms to U-1-14, more like 1M when off - Glide attenuator (B10k) (join two left pins from below) - Clock rate goes down when resistance goes up, opposite to expectation. Schematic fixes: - C1 is too small for a single 2.5 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST ZE series connector, BM16B-ZESS-TBT (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.5 mm² wire, reinforced insulation, conductor diameter 1.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf 3x3mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-225, 13.0x13.0mm, 225 Ball, 15x15 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid, YBG pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole straight socket strip, 1x12, 2.54mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole pin header SMD 1x34 2.54mm single row Through hole socket strip SMD 1x13 1.27mm single row style1 pin1 left Surface mounted socket strip THT 2x34 2.54mm double row surface-mounted straight pin header, 1x37, 1.00mm pitch, single row Through hole angled pin header, 2x21, 1.00mm pitch, single row Through hole straight socket strip, 1x36, 1.00mm pitch, double rows Surface mounted socket strip THT 1x11 2.00mm single row Through hole vertical IDC box header, 2x07, 2.54mm pitch, 6mm pin length, double rows Surface mounted pin header SMD 2x37 2.54mm.

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