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BackDefinition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (area) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole angled socket strip THT 2x39 2.00mm double row Through hole pin header SMD 1x38 1.00mm single row Through hole angled pin header THT 1x20 1.27mm single row Through hole pin header SMD 2x36 1.27mm double row Through hole pin header THT 2x40 1.27mm double row Connector IDC Locked, 10 contacts, compatible header: PANCON HE10 (Series 50, (https://www.reboul.fr/storage/00003af6.pdf Through hole pin header THT 2x30 1.27mm double row Through hole angled pin header THT 1x06 2.54mm single row Through hole angled pin header, 2x04, 2.54mm pitch, 8.51mm socket length, single row style2 pin1 right Through hole straight pin header, 1x05, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip THT 1x31 1.00mm single row Through hole angled pin header THT 1x06 5.08mm.
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