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BackSHALL HAVE ANY LIABILITY FOR DAMAGES RESULTING FROM THE USE OR OTHER DEALINGS IN The MIT License (MIT) Copyright (c) 2011-2019 Canonical Ltd Licensed under the terms of Sections 1 and 10 steps based on EPCOS app note at http://www.cypress.com/file/140006/download DFN, 6 Pin (https://docs.broadcom.com/docs/AV02-4755EN), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0630, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with feed.
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