synth_tools

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Strip, HLE-140-02-xxx-DV-LC, 40 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 100-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad LQFP, 32 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2055-3)), generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0404-8-51, 4 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32 Pin (https://www.ti.com/lit/ds/symlink/ads127l01.pdf#page=87), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B10B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-40DP-0.5V, 40 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1130, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 24 Pin (https://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=49), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-124-02-xxx-DV-LC, 24 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator connector Hirose DF13 through hole, DF11-30DP-2DSA, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_8x8_with%206_5x6_5%20EP_JXX_C04-0437A.pdf), generated with kicad-footprint-generator connector JST VH PBT series connector, B08B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 16 Pin (https://www.vishay.com/docs/83513/tcmd1000.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, 2 LEDs, https://www.haloelectronics.com/pdf/fastjack-100baset.pdf 10/100 Ethernet RJ45 Tab-Down Halo FastJack, Shielded, 2 LED, https://www.amphenolcanada.com/ProductSearch/drawings/AC/RJHSE538X.pdf RJ45 8p8c ethernet POE 10/100/1000 Base-T RJ45 single port with LEDs and 75W POE, https://productfinder.pulseeng.com/doc_type/WEB301/doc_num/J432/doc_part/J432.pdf RJ45 8p8c dual ethernet cat5 1 Port RJ45 8P8C receptacle, shielded, with magnetics, through hole, DF63R-2P-3.96DSA, 2 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0250, 25 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ108178.pdf), generated with kicad-footprint-generator Hirose DF63 through hole, DF63M-1P-3.96DSA, 1 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, B22B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Molex Picoflex Ribbon-Cable Connectors, 90814-0010, 10 Pins per row (http://www.molex.com/pdm_docs/sd/439151404_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 13, Wuerth electronics 9774025951 (https://katalog.we-online.de/em/datasheet/9774025951.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py Plastic Small Outline Package (MS) [MSOP], variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x30.12mm (see e.g.

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