Labels Milestones
BackNexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch.
- 236-506 45Degree pitch 10mm Varistor, diameter 7mm, width.
- Mm Surface Mount Slide Switch, right-angle.
- Slim, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/b40fs.pdf SMD diode bridge.