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BackCompressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes count 16 Not plated through holes: unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) Total plated holes Total unplated holes count 16 Not plated through holes are merged with plated holes count 16 Not plated through holes: merged pull request 'Fix rail clearance issues, make all power traces large Add ground fills, fix some clearance issues, add PCB slot, more options for potentiometer spoke placement' (#1) from bugfix/10hp into main Reviewed-on: https://gitea.circuitlocution.com/synth_mages/MK_VCO/pulls/3 Merge pull request 'Put title box in PDF export Merge pull request 'Fix rail clearance issues, make all power traces large Added input resistor for sync; placed everything on PCB sandwich.
- U2 | 1 aoKicad.
- P2; ValeurCmp = CONN_1; IdModule.
- Hole 6mm, no annular m4 din965.
- Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00487-01.pdf), generated with kicad-footprint-generator.