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Bodges: Errant connection between R25 and R1, probably a result of switching to pcb-mounted panel components version

main VCA/Panels/dual_vca.scad 393 lines $fn=FN; footprint_depth = 1; $n > 0; $abs = "$host$path/$rel"; function api_version() { $re = array( '#(/\.?/)#', '#/(?!\.\.)[^/]+/\.\./#' ); for ($n = 1; // actually.. I don't know what this does. Pad = 0.2; // Padding to maintain manifold // // Whether to create holes for a single 0.75 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4160, 16 Pins (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=826576&DocType=Customer+Drawing&DocLang=English), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5566-24A, example for new mpn: 39-30-0180, 9 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1010, with PCB locator, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.

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