Labels Milestones
BackSimulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) (with 4 slots.
- 10 bump 3x4 (area) array, NSMD pad.
- SMD 2x26 1.00mm double row surface-mounted straight pin.
- -6.16972 19.9507 facet normal 4.808466e-001 8.424486e-001 2.430369e-001 vertex.
- 9.978252e-001 -6.591540e-002 0.000000e+000 vertex 5.622908e+000 -8.258408e-001 2.496000e+001.