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Socket 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 3x-dip-switch.

• Unescape main ENV/README.md 3 lines.
• 1719383 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719383), generated with kicad-footprint-generator.

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