Labels Milestones
Back600mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT DIP DIL PDIP 2.54mm 7.62mm 300mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 6x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 12x-dip-switch SPST CTS_Series194-12MSTN, Piano, row spacing 5.08 mm (200 mils), body size 9.78x4.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 3x-dip-switch SPST Copal_CVS-03xB, Slide, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 10x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 10-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25 FBGA-78, 10.5x9.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00855D.pdf#page=1 TFBGA-196, 11.0x11.0mm, 196 Ball, 14x14 Layout, 0.75mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/SAMA5D2-Series-Data-Sheet-DS60001476C.pdf#page=2956 FBGA-78, 10.6x7.5mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, NDQ, 5 pin (https://www.ti.com/lit/ml/mmsf022/mmsf022.pdf TO-PMOD-11 11-pin switching regulator package, http://www.ti.com/lit/ml/mmsf025/mmsf025.pdf Vishay PowerPAK SC70 single transistor package http://www.vishay.com/docs/70487/70487.pdf powerpak sc70 sc-70 dual Vishay PowerPAK 1212-8 Single Zetex, SMD, 8 pin package (http://datasheet.octopart.com/ZDT6758TA-Zetex-datasheet-68057.pdf Diodes Incorporated (https://www.diodes.com/assets/Package-Files/U-DFN2510-10-Type-CJ.pdf U-DFN2020-6 (Type F) (https://www.diodes.com/assets/Package-Files/U-DFN2020-6-Type-F.pdf HVQFN, 16 Pin (https://ams.com/documents/20143/36005/AS5055A_DS000304_2-00.pdf#page=24), generated with kicad-footprint-generator Molex Panelmate series connector, 14110513001xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13001XXX_100228421DRW046C.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0610, with PCB locator, 5 Pins per row (http://www.molex.com/pdm_docs/sd/1053131208_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 56 Pin (http://www.cypress.com/file/416486/download#page=40), generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 4, Wuerth electronics 9774080482 (https://katalog.we-online.de/em/datasheet/9774080482.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 1-770870-x, 3 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Soldered wire connection, for 4 times 0.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 2mm.
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