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162x14mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00298 pitch 10mm Varistor, diameter 21.5mm, width 5.1mm, pitch 5mm size 51.5x15mm^2 drill 1.2mm pad 3mm Terminal Block Phoenix PTSM-0,5-2-2.5-V-THR vertical pitch 5mm Varistor, diameter 15.5mm, width 6.3mm, pitch 7.5mm Varistor, diameter 7mm, width 5.4mm, pitch 5mm size 25x8.1mm^2 drill 1.1mm pad 2.1mm terminal block RND 205-00006 pitch 5mm size 40x7.6mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00305 pitch 10mm size 25x8.1mm^2 drill 1.1mm pad 2.1mm terminal block RND 205-00082 pitch 10mm Varistor, diameter 7mm, width 5.5mm, pitch 5mm size 40x10mm^2 drill 1.3mm pad 2.6mm terminal block RND 205-00239 pitch 5.08mm size 76.2x9.8mm^2 drill 1.3mm pad 2.6mm Terminal Block WAGO 236-409, 45Degree (cable under 45degree), 4 pins, pitch 5mm, size 20x8.1mm^2, drill diamater 1.3mm, pad diameter 3mm, see , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block Phoenix MKDS-1,5-8-5.08, 8 pins, https://www.diodes.com/assets/Datasheets/ZXSBMR16PT8.pdf 8-pin SOT-383FL package, http://www.onsemi.com/pub_link/Collateral/ENA2267-D.PDF SOT-543 4 lead surface package SOT 963 6 pins package 1x0.8mm pitch 0.35mm SOT-1123 small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 20 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 44 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf 28-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic Dual Flat No-Lead Package, 3x3mm Body (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body, 2.00 mm Footprint [HTQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 56 leads (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot361-1_po.pdf TSSOP, 28 Pin (http://www.ti.com/lit/ds/symlink/lm5175.pdf#page=40), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 48 Pin (http://ww1.microchip.com/downloads/en/devicedoc/00002117f.pdf#page=69), generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 1006 3 pins THT ceramic resonator filter Ceramic Resomator/Filter 8.0x3.5mm^2, length*width=8.0x3.5mm^2 package, package length=10.0mm, package width=5.0mm, 2 pins LED_Rectangular, Rectangular, Rectangular size 4.8x2.5mm^2 diameter 2.0mm 2 pins LED, Round, FlatTop, Rectangular size 4.5x1.6mm^2.

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