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Https://www.littelfuse.com/~/media/electronics/datasheets/reed_switches/littelfuse_reed_switches_mdsm_dt_datasheet.pdf.pdf Littlefuse Reed SPDT Switch Light Touch Switch, http://industrial.panasonic.com/cdbs/www-data/pdf/ATK0000/ATK0000CE3.pdf SMD SMT SPST EVQPUM EVQPUD SMD 1x-dip-switch SPST Copal_CHS-01A, Slide, row spacing 7.62 mm (300 mils 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 14-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 24-pin zero insertion force socket, through-hole, row spacing 5.08 mm (200 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP DIL PDIP 2.54mm 7.62mm 300mil Socket 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP SMDIP 2.54mm 25.24mm 993mil 42-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 2x-dip-switch SPST CTS_Series194-2MSTN, Piano, row spacing 8.61 mm (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 4x-dip-switch SPST KingTek_DSHP04TS, Slide, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 4x-dip-switch SPST Omron_A6S-410x, Slide, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 package, like 6-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SO), see http://datasheet.octopart.com/OPIA403BTRE-Optek-datasheet-5328560.pdf 4-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SN) - Narrow, 3.90 mm Body [TSSOP] with exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf SSOP 0.65 exposed pad (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF WDFN, 12 Pin (http://www.ti.com/lit/ml/mpqf391c/mpqf391c.pdf), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MCV_1,5/13-GF-3.5; number of pins: 06; pin pitch: 5.08mm; Vertical || order number: 1924538 16A (HC Generic Phoenix Contact connector footprint for: MSTBV_2,5/12-GF-5,08; number.

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