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Operational Amplifiers, DIP-14/SOIC-14"/> Operational amplifier, DIP-8 2 pin Molex connector KK254 Molex header 2.54 mm spacing | | | | R8, R10, R12 | 3 | A1M | Potentiometer | | R21, R22, R23 | 3 | A1M | Potentiometer | | | | S1 | 1 | TL074 | Quad operational amplifier, DIP-14 A-1135 2 8 pin SIM connector for 2.4mm PCB's with 05 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 08 contacts (not polarized Highspeed card edge connector for PCB's with 60 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 70 contacts (polarized Highspeed card edge card connector socket for 1.57mm PCBs, vertical (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf conn samtec card-edge socket high-speed 0.8 mm Highspeed card edge card connector socket for 1.57mm PCBs, vertical (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 324 0.8 CS324 CSG324 BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA.

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