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Neosid, Micro Coil, Inductor, Ms36-L, SMD, Fixed inductor, SMD, https://neosid.de/import-data/product-pdf/neoFestind_Ms85.pdf Neosid Ms85 Ms85T SMD Inductor Bourns SRR1260 series SMD inductor Bourns SRU8028 SMD inductor https://www.bourns.com/docs/Product-Datasheets/SRN1060.pdf Bourns SRN1060 series SMD inductor, https://www.bourns.com/docs/Product-Datasheets/SRN4018.pdf Bourns SRN4018 series SMD inductor Inductor, Bourns, SRP5030T, 5.7mmx5.2mm (Script generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a single 0.75 mm² wire, basic insulation, conductor diameter 0.65mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.75 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 48 Pin (https://www.trinamic.com/fileadmin/assets/Products/ICs_Documents/TMC2041_datasheet.pdf#page=62), generated with kicad-footprint-generator connector Molex Mega-Fit top entry Molex Pico-Clasp series connector, SM10B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF11-30DP-2DSA, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic Dual Flat, No Lead Package - 9x9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm.

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