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Definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole IDC box header THT 1x24 1.00mm single row Through hole pin header THT 2x34 2.00mm double row Through hole socket strip THT 1x05 2.00mm single row Surface mounted socket strip THT 2x16 1.27mm double row Through hole socket strip THT 2x06 2.54mm double row Through hole angled pin header THT 1x27 2.00mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x33 1.27mm double row Through hole socket strip THT 2x04 2.54mm double row Through hole angled pin header, 1x21, 2.54mm pitch, double cols (from Kicad 4.0.7!), script generated Surface mounted socket strip SMD 1x03 1.00mm single row Through hole angled pin header, 2x26, 2.00mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x03.

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