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BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole angled pin header, 2x35, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x18, 2.00mm pitch, single row Through hole vertical IDC box header, 2x25, 2.54mm pitch, single row Through hole straight socket strip, 2x03, 2.54mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x34 1.27mm single row style1 pin1 left Surface mounted socket strip SMD 2x37 2.54mm double row Through hole straight socket strip, 2x37, 2.00mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 2x34 1.00mm double row Through hole socket strip THT 1x26 1.00mm single row Through hole straight pin header, 2x25, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole straight pin header, 2x13, 2.54mm pitch, single row Surface mounted pin header SMD 1x13 2.54mm single row (from Kicad 4.0.7), script generated Through hole pin header THT 2x07 2.54mm double row surface-mounted straight socket strip, 2x40, 2.54mm pitch, single row Through hole Samtec HPM power header series 3.81mm post length THT.

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