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SmallPads 48-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 22-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads.

• Is conspicuously marked or.
• 0.109221 0.0703601 facet normal.
• 9.225611e+01 3.455000e+01 vertex -9.129400e+01 9.507470e+01 1.855000e+01.
• TFBGA-196, 11.0x11.0mm, 196 Ball, 14x14 Layout, 0.75mm.

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