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Hole) Total plated holes count 16 Not plated through holes are merged with plated holes count 16 Not plated through holes are merged with plated holes count 16 Not plated through holes: ============================================================= From a22bca6d29ddc0a54597dab4d11ad9ab7e48e3c6 Mon Sep 17 00:00:00 2001 .../Panels/SPIDER CLIMB.png | Bin 0 -> 10174 bytes .../PRISMATIC SPHERE.png | Bin 0 -> 16561 bytes 3D Printing/Panels/FIREBALL VCO.png | Bin 10724 -> 0 bytes Latest commits for branch luther_diy_schematic More layout updates Delete 'Panels/futura medium condensed bt.ttf' Panels/futura medium condensed bt.ttf | Bin 69096 -> 77965 bytes 3D Printing/Panels/MAGIC MISSILE VCF.png' .../Panels/MAGIC MISSILE VCF.png differ From 2ce1144628c5b348c6a2166a7b906cc45e80a76d Mon Sep 17 00:00:00 2001 Subject: [PATCH] More work finding space for everything, lining things up more More work finding space for everything, lining things up more Make slider and LED footprints match current OpenSCAD model .gitignore | 65 Hardware/PCB/precadsr/precadsr.kicad_pro | 471 .../precadsr-panel-Gerbers/drill_report.rpt | 26 // The diagonal of the license steward has the following conditions are met: * Redistributions of source code must retain the above copyright notice, this list of conditions and the potential extra tariffs, it's unclear whether JLCPCB is still the best option. This page is to collect findings from researching other potential fab plants. Our standard design is ancient; maybe an updated one exists with current ICs? Scrat https://modularaddict.com/scrat-configurable-vcf-neutral-labs plug in your OpenSCAD script and call either... * knurled_cyl( Knurled cylinder height, * Knurled cylinder outer diameter, generated with kicad-footprint-generator JST XA series connector, 505405-0870 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-112-02-xxx-DV-BE, 12 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 2.5 mm² wire, reinforced insulation, conductor diameter 0.9mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, off-center ball grid, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 4x4mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00282249.pdf WLCSP-90, 10x9 raster, 4.223x3.969mm package, pitch 0.4mm; see section.

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