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Ship), per PCB, of minimum order size is less than 3, use the 4 pins (http://www.qingpu-electronics.com/en/products/WQP-PJ320E-177.html PJ31060-I 6pin SMD 3.5mm stereo headphones jack. Headphones jack (http://www.china-bsun.com/Product48/1577.html headphones jack plug stereo 3.5mm PJ31060-I PJ31060 TRS 3.5mm, horizontal, through-hole, https://www.cui.com/product/resource/sj1-353xng.pdf TRS 3.5mm, horizontal, through-hole, with switch, vertical shaft, http://www.alps.com/prod/info/E/HTML/Encoder/Incremental/EC12E/EC12E1240405.html Alps rotary encoder, PEC09, with switch, vertical shaft, https://www.bourns.com/docs/product-datasheets/pec12r.pdf Sensortech MiCS MEMS sensor Infineon, IP57, XENSIV, LGA-5, https://www.infineon.com/dgdl/Infineon-IM73A135-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7f2a768a017fadec36b84500 MEMS Microphone LGA Dust Water TDK InvenSense MEMS I2S Microphone: https://invensense.tdk.com/products/ics-43434/ microphone MEMS I2S ICS-43434 TDK InvenSense Knowles MEMS I2S ICS-43434 TDK InvenSense MEMS I2S Microphone: https://invensense.tdk.com/products/ics-43434/ microphone MEMS I2S Microphone: https://www.knowles.com/subdepartment/dpt-microphones/subdpt-sisonic-surface-mount-mems microphone MEMS I2S Microphone: https://www.knowles.com/subdepartment/dpt-microphones/subdpt-sisonic-surface-mount-mems microphone MEMS I2S SPH0645LM4H Knowles Sensirion, SHT40, SHT41, SHT45, DFN, 4 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=10047&prodName=TLP3123), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 48 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT232H.pdf#page=49), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2061, 6 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2102, With thermal vias in pads, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 501920-5001, 50 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-146-02-xxx-DV-LC, 46 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, B8B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0910, with PCB locator, 6 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13C-10P-1.25V%2851%29/), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 0.25 mm² wires, basic insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 2.5 mm² wire, basic insulation, conductor diameter 0.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py WDFN, 6 pin, 4.0x2.6, 0.65P; Two exposed pads, (https://www.onsemi.com/pub/Collateral/511BZ.PDF.

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