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Pin (https://www.diodes.com/assets/Package-Files/U-DFN2020-6%20(Type%20C).pdf), generated with kicad-footprint-generator JST XA series connector, 501331-1007 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MCV_1,5/10-GF-5.08; number of pins: 13; pin pitch: 3.50mm; Vertical; threaded flange || order number: 1843318 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/10-G-3.81; number of pins: 11; pin pitch: 3.81mm; Vertical || order number: 1766673 12A 630V Generic Phoenix Contact connector footprint for: MCV_1,5/4-GF-3.81; number of pins: 12; pin pitch: 3.81mm; Vertical; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x6.5 C or ISO 7049-ST 2.2x4.5 C or ISO 7049-ST 2.2x4.5 C or ISO 7049-ST 2.2x6.5 C or ISO 7049-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1924088 16A (HC Generic Phoenix Contact SPT 5/8-H-7.5-ZB Terminal Block, 1719192 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719192), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-129-02-xxx-DV-BE-LC, 29 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/pca9548a.pdf#page=37), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0930, 9 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2103, 3 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000992393), generated with kicad-footprint-generator JST ZE series connector, 502382-1270 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 64 Pin (https://datasheet.lcsc.com/szlcsc/Realtek-Semicon-RTL8211EG-VB-CG_C69264.pdf#page=77), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: GMSTBV_2,5/7-GF-7,62; number of pins: 10; pin pitch: 5.00mm; Angled || order number: 1836396 8A 320V Generic Phoenix Contact connector footprint for: MCV_1,5/10-GF-3.81; number of pins: 09; pin pitch: 3.81mm; Vertical; threaded flange || order number: 1776028 12A Generic Phoenix Contact connector footprint for: GMSTBVA_2,5/6-G-7,62; number of pins: 02; pin pitch: 5.08mm; Vertical; threaded flange; footprint includes mount hole for a single 0.15 mm² wire, basic insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2161, 16 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOP, 4 Pin (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/0_Datasheets/Humidity/Sensirion_Humidity_Sensors_SHTC3_Datasheet.pdf Sensirion DFN-8 SHT3x-DIS (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/2_Humidity_Sensors/Datasheets/Sensirion_Humidity_Sensors_SHT3x_Datasheet_digital.pdf 24-Lead Plastic Shrink Small Outline (SO), see https://www.elpro.org/de/index.php?controller=attachment&id_attachment=339 SO, 4 Pin (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/0_Datasheets/Humidity/Sensirion_Humidity_Sensors_SHTC3_Datasheet.pdf Sensirion DFN-8 SHT3x-DIS (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/2_Humidity_Sensors/Datasheets/Sensirion_Humidity_Sensors_SHT3x_Datasheet_digital.pdf 24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils SMD DIP DIL PDIP 2.54mm 22.86mm 900mil 64-lead though-hole mounted DIP package, row spacing 7.62 mm.

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