Labels Milestones
BackSimulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole Total plated holes count 16 ============================================================= Total unplated holes count 16 ============================================================= Total unplated holes count.
- 1.016 2.54 (end -1.016.
- 0.995729 facet normal 0.705398 0.0694843 0.705398 vertex 0.
- Normal 0.7808 0.129508 0.611211 facet.
- 30.479999999999997mm width 15.239999999999998mm Bourns 8100 L_CommonMode_Toroid.