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Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with Korean HRO Parts Elec TYPE-C-31-G-06 USB Type-C Receptacle Hybrid CNCTech C-ARA1-AK51X USB Type C, Right Angle, Surface Mount, ZIF, 15 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator connector wire 0.75sqmm strain-relief Soldered wire connection with double feed through strain relief, for.

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