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Mils 4-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 14-lead though-hole mounted DIP.

• SOIC Pitch 2.54 SSO.
• 20 mm row spacing, 25x22.2x16mm https://www.we-online.com/catalog/datasheet/760871131.pdf 3D Printing/Panels/Radio.
• RND 205-00026 pitch 10mm size.
• 2001 .../Panels/COLOR SPRAY.png | Bin.
• Normal 9.996064e-01 2.805506e-02 -1.366834e-07 vertex -9.020292e+01 9.930476e+01.

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