Labels Milestones
BackSocket 42-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket LongPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead though-hole mounted DIP package, row spacing 10.16 mm.