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Diameter2.548mm, hole diameter 1.0mm wire loop as test Point, square 2.5mm side length, hole diameter 1.3mm, wire diameter 1.0mm THT rectangular pad as test Point, diameter 3.0mm, hole diameter 1.3mm, wire diameter 0.5mm test point plated hole Plated Hole as test point, loop diameter2.6mm, hole diameter 1.5mm THT rectangular pad as test Point, square 2.5mm side length SMD pad as test point, loop diameter2.6mm, hole diameter 1.2mm, length 11.3mm, width 2.8mm solder Pin_ diameter 1.3mm, hole diameter 1.3mm, wire diameter 1.0mm wire loop as test point, loop diameter2.548mm, hole diameter 1.3mm, wire diameter 0.5mm test point THT pad as test point, pitch 2.0mm, hole diameter 0.7mm, length 6.5mm, width 1.8mm solder Pin_ diameter 1.0mm, hole diameter 1.0mm wire loop as test Point, square 1.0mm side length, hole diameter 1.2mm THT rectangular pad as test point, pitch 2.54mm, size 25.9x6.2mm^2, drill diamater 1.2mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block Metz Connect Type175_RT02704HBLC, 4 pins, pitch 3.5mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 8 Pin (https://ww2.minicircuits.com/case_style/XX211.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 1.5 mm² wire, reinforced insulation, conductor diameter 0.65mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 16 Pin (https://www.stcmicro.com/datasheet/STC15F2K60S2-en.pdf#page=156), generated with kicad-footprint-generator JST GH series connector, B12B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact Style, 15 Circuits (http://www.molex.com/pdm_docs/sd/5022441530_sd.pdf Molex 0.50mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-2391, 23 Circuits (http://www.molex.com/pdm_docs/sd/5022502391_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 2 times 0.75 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 3.5mm, size 8x8.3mm^2, drill diamater 1.3mm, pad diameter 3mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius.

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