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FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, VQFN-HR RNN0018A (http://www.ti.com/lit/ds/symlink/tps568215.pdf QFN, 16 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/LTC7810.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, old mpn/engineering number: 5569-10A1, example for new mpn: 39-30-0240, 12 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator ipc_plcc_jLead_generator.py PLCC, 44 pins, single row Surface mounted pin header THT 1x21 2.54mm single row (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x20 2.00mm single row Through hole pin header THT 1x08 5.08mm single row Surface mounted pin header THT 2x02 1.27mm double row Through hole straight pin header, e.g. For Wieson part number 2366C888-007 Molex 47053-1000, Foxconn HF27040-M1, Tyco 1470947-1 or equivalent, see http://www.formfactors.org/developer%5Cspecs%5Crev1_2_public.pdf pin header THT 1x17 2.00mm single row Through hole pin header THT 2x09 1.27mm double row Through hole horizontal IDC header THT 1x21 2.00mm single row Through hole angled pin header, 2x34, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole IDC header, 2x10, 2.54mm pitch, DIN 41651 / IEC 60603-13.

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