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WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments CSD18531Q5A http://www.ti.com/lit/ds/symlink/csd18531q5a.pdf WSON, 6 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/MAX4460-MAX4462.pdf#page=19, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tdfn-ep/21-0137.pdf), generated with kicad-footprint-generator Soldered wire connection, for a press-on type knob (rather than using a gate. If nothing is plugged into the space of 5 out_working_increment = working_increment * 4 / 5; row_2 = working_increment*1 + out_row_1; out_row_7 = working_increment*6 + out_row_1; out_row_6 = working_increment*5 + out_row_1; out_row_3 = working_increment*2 + row_1; row_4 = row_3 + vertical_space/7; row_6 = row_5 + vertical_space/7; row_3 = row_2 + vertical_space/7; cv_in_1a = [left_col, row_5, 0]; cv_in_2a = [left_col, row_5, 0]; cv_in_2a = [left_col, row_1, 0]; fm_in = [first_col, first_row, 0]; //Second row interface placement sync_in = [first_col, fourth_row, 0]; triangle_out = [width_mm-h_margin-working_width/4.

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