3
1
Back

Bourns 3224X Potentiometer, horizontal, ACP CA9-H5, http://www.acptechnologies.com/wp-content/uploads/2017/05/02-ACP-CA9-CE9.pdf Potentiometer horizontal Bourns 3214G Potentiometer, horizontal, Piher PC-16 Triple Potentiometer, horizontal, Trimmer, RM-063 http://www.runtron.com/down/PDF%20Datasheet/Carbon%20Film%20Potentiometer/RM065%20RM063.pdf Potentiometer, vertical, Alps RK09K Single, https://tech.alpsalpine.com/prod/e/pdf/potentiometer/rotarypotentiometers/rk09k/rk09k.pdf Potentiometer vertical Bourns 3299Y Potentiometer, horizontal, Bourns 3296P, https://www.bourns.com/pdfs/3296.pdf Potentiometer vertical hole ACP CA14V-15 Potentiometer, vertical, Bourns 3266W, https://www.bourns.com/docs/Product-Datasheets/3266.pdf Potentiometer horizontal ACP CA14-H5 Potentiometer, vertical, Bourns PRS11S, http://www.bourns.com/docs/Product-Datasheets/PRS11S.pdf Potentiometer vertical Bourns PRS11S Potentiometer, Bourns, TC33X, Vertical, https://www.bourns.com/pdfs/TC33.pdf Potentiometer Bourns TC33X Vertical Potentiometer, vertical, shaft hole, ACP CA14V-15, http://www.acptechnologies.com/wp-content/uploads/2017/10/03-ACP-CA14-CE14.pdf Potentiometer horizontal Vishay 148E-149E Single Potentiometer, horizontal, Alps RK163 Dual 1110U1Q 1110TNP 1110U2A 1110U0Q Potentiometer, horizontal, Bourns 3339W, http://www.bourns.com/docs/Product-Datasheets/3339.pdf Potentiometer vertical hole ACP CA9-VSMD Potentiometer, vertical, shaft hole, allowing to create holes for a single 0.25 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.8mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf WLCSP-144, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition Appendix A BGA 400.

New Pull Request