Labels Milestones
BackPitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical RM 5.45mm TO-264-3, Vertical, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Horizontal RM 1.7mm Pentawatt Multiwatt-5 TO-220-7, Vertical, RM 1.7mm, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 5.45mm TO-3P-3, Vertical, RM 2.54mm, staggered type-2 TO-220-9, Vertical, RM 2.54mm, staggered type-2, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 0.97mm Multiwatt-9 staggered type-2 TO-220-11, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-2 TO-220-5, Horizontal, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Horizontal RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220F-5 Vertical RM 1.7mm staggered type-1 TO-220-9 Vertical RM 5.45mm TO-264-3, Vertical, RM 2.54mm, staggered type-2 TO-220-7, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD DIP Switch SPST Piano 7.62mm 300mil LowProfile 1x-dip-switch SPST Copal_CHS-01B, Slide, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil 2x-dip-switch SPST , Slide, row spacing 6.73 mm (264 mils), body size 10.8x4.1mm DIP Switch SPST 1P1T tactile switch 6mm ALPS SKHH right angle (source: https://www.cnctech.us/pdfs/C-ARA1-AK512.pdf USB C Type-C Receptacle SMD USB 2.0 Type B Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-154 , 24 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Molex 734 Male header.
- Microsystems SIP-3, 1.27mm Pitch (https://www.diodes.com/assets/Package-Files/SIP-3-Bulk-Pack.pdf Diodes SIP-3 Ammo.
- IM-Series Relays, DPDR, Pitch 5.08 AXICOM IM-Series Relay.