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Non-latching, single coil latching, https://content.kemet.com/datasheets/KEM_R7002_EC2_EE2.pdf Kemet EC2 signal relay DPDT non single coil latching through hole 2.7mm, height 7, Wuerth electronics 97730506334 (https://katalog.we-online.com/em/datasheet/97730506334.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 1 mm² wires, reinforced insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.5 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 2 mm² wire, reinforced insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-6010, 60 Pins (http://www.molex.com/pdm_docs/sd/5024301410_sd.pdf), generated with kicad-footprint-generator Fuse SMD 2920 (7451 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 56 leads; body width 5.3 mm; (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 transistor TO-92 2-pin leads in-line, wide, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220F-5 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220F-15, Vertical, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Vertical RM 1.27mm MultiwattF-15 staggered type-1 TO-220-4, Vertical, RM 5.45mm, , see http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3 Horizontal RM 5.45mm TO-3P-3, Vertical, RM 1.7mm, staggered type-1, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421.pdf?domain=www.linear.com, https://www.diodes.com/assets/Package-Files/TO220-5.pdf TO-220-5 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220-7, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-1 TO-220-4, Vertical, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Horizontal RM 4.58mm IPAK TO-251-2, Vertical, RM 5.08mm, see https://www.centralsemi.com/PDFS/CASE/TO-220-2PD.PDF TO-220-2 Horizontal RM 10.9mm TO-264-2, Vertical, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Vertical RM 1.27mm Multiwatt-7 staggered type-1 TO-220-9, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-11, Horizontal, RM 5.475mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Horizontal RM 2.54mm TO-220-4, Horizontal, RM 5.08mm, see http://www.vishay.com/docs/88769/woo5g.pdf diode bridge 9.0mm 8.85mm WOB pitch 5.08mm size 61x11.2mm^2 drill 1.3mm pad 2.6mm terminal block Metz Connect Type171_RT13706HBWC pitch 7.5mm size 59x15mm^2 drill 1.2mm pad 2.4mm Terminal Block Phoenix MKDS-1,5-8, 8 pins, pitch 7.5mm, size 30x9mm^2, drill diamater 1.3mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3.

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