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BackIpc_gullwing_generator.py FE Package; 16-Lead Plastic Shrink Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm Footprint [HTQFP] thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf.
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