Labels Milestones
BackPackage, 4-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body (see Atmel Appnote 8826 64-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x31 2.54mm double row Through hole angled pin header SMD 2x18 1.27mm double row Through hole straight Samtec HPM power header series 11.94mm post length THT 1x11 5.08mm single row style2.
- Vertex -4.053452e+000 2.292537e+000 2.482134e+001.
- 3.005 9.425 vertex -0.4 3.15337 18.6638 vertex -1.28613.
- -0.630119 0.773011 0.0735069 vertex 0.759029.