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Raster, 3.357x3.657mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-100, 10x10, 9x9mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-81, 9x9 raster, 4.039x3.951mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf UFBGA 132 Pins, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; see section 6.6 of http://www.st.com/resource/en/datasheet/DM00273119.pdf X1-WLB0909, 0.89x0.89mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, off-center ball grid, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf DFN, 6 Pin (https://www.renesas.com/us/en/document/psc/package-drawing-hodfn-6pin-l615x16?language=en&r=568376 Miniature Crystal Clock Oscillator TG2520 series, https://support.epson.biz/td/api/doc_check.php?dl=app_TG2520SMN&lang=en Latest commits for file Images/captest.png From 4efd2875e878899162f2c2dc07deaf41da7fb0b0 Mon Sep 17 00:00:00 2001 Subject: [PATCH] More random files c6741b48f0ef8a6e69ecbca1a47bc4f4b481e2a3 Notes from MK's PCB livestream 3afa35e4b1 PCB initial layout, no traces "min_copper_edge_clearance": 0.0, PCB initial layout, no traces "silk_line_width": 0.15, PCB initial layout, no traces }, More tweaks after pro review More tweaks after pro review 2 From 057198b8de00d90dc9311b86f496b649dca09ec0 Mon Sep 17 00:00:00 2001 Subject: [PATCH 05/13] move bugs to md file to be placed because it is not included in repo 3D Printing/{ => Cases}/6u_wing_v1.scad (100% create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/fastestenv_Switch_Hole.kicad_mod delete mode 100644 Envelope/Envelope.kicad_sch create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Molex_KK-254_AE-6410-02A_1x02_P2.54mm_Vertical.kicad_mod delete mode 100644 3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/FIREBALL VCO.png Normal file View File Hardware/Panel/precadsr_panel_al_Gerbers/precadsr_panel_al-NPTH.drl Normal file View File 3D Printing/Pot_Knobs/Guitar_Amp_Knob-2_ring_bell.stl Executable file View File 3D Printing/Cases/Eurorack Modular Case/EuroRack_Case_End_Male.stl Executable file View File Images/retrigger.png Normal file View File 3D Printing/Tools/Eurorack_Nut_Driver_8mm.stl Executable file View File Datasheets/2N3903-Motorola.pdf Executable file View File 3D Printing/AD&D 1e spell names in Filmoscope Quentin/BLADE BARRIER.png differ Binary files a/3D Printing/AD&D 1e spell names rendered as raster using Filmoscope Quentin font face is not a jellybean, so $3/ea for sketchy NOS on amazon ** CA3080 design is 1.6mm thick, 2-sided copper clad fiberglass. ENIG is unnecessary. Shipping for minimum order* of Fireball main PCBs (maybe the same form factor, with maybe a little bit of margin footprint_depth = .25; //non-printing, barely-visible outline of component footprints.

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