Labels Milestones
BackElectronics 9775031960 (https://katalog.we-online.com/em/datasheet/9775031960.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.8mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf.
- -6.013035e-01 3.312517e-04 facet normal 5.032445e-001 -8.627504e-001 4.905997e-002.
- Normal -5.393483e-002 -9.438588e-002 9.940736e-001 facet normal.
- 0.991505 0.0895749 facet normal -0.0122191 0.0985567 0.995056.