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4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline transistor (see http://www.onsemi.com/pub/Collateral/NST3906F3-D.PDF 3-pin SuperSOT package https://www.fairchildsemi.com/package-drawings/MA/MA03B.pdf 6-pin SuperSOT package http://www.mouser.com/ds/2/149/FMB5551-889214.pdf 8-pin SuperSOT package, http://www.icbank.com/icbank_data/semi_package/ssot8_dim.pdf Power MOSFET package, 3x3mm (see https://www.fairchildsemi.com/datasheets/FD/FDMC8032L.pdf Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm 8-Lead Plastic DFN (3mm x 2mm) 0.40mm pitch DDB Package; 10-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic DFN (5mm x 5mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package.

Normal -0.0463767 0.470877 0.880979 facet.
9.8mm WOG pitch 5.08mm size 66x9.8mm^2.
0.0729941 -0.976261 0.203926 vertex 7.22332 1.01854 7.61242.

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