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9.55875 3.26879 vertex -6.50317 6.85323 3.54602 facet normal -0.00987306 -0.15155 0.9884 facet normal -0.884719 0.268373 0.381114 vertex 8.06528 5.8029 2.94279 vertex 0 9.96384 2.94279 facet normal -0.94716 -0.0961108 0.306023 facet normal 0.758301 0.622313 0.19418 vertex -8.58625 5.28808 2.58057 facet normal -2.880153e-004 -5.040268e-004 -9.999998e-001 ## Documentation: ### Documentation: * [Schematic](Docs/precadsr.pdf) * PCB layout: [front](Docs/precadsr_layout_front.pdf), [back](Docs/precadsr_layout_back.pdf) * [BOM](Docs/precadsr_bom.md) * [Build notes](Docs/build.md ## GitHub repository * [https://github.com/holmesrichards/precadsr](https://github.com/holmesrichards/precadsr ## Submodules This repo uses submodules aoKicad and Kosmo_panel. To clone: ``` git clone git@github.com:holmesrichards/precadsr.git git clone --recurse-submodules git@gitlab.com:rsholmes/precadsr.git ``` Or if you don't want the hole for mounting screw: ISO 1481-ST 2.2x4.5 C or ISO 7049-ST 2.2x4.5 C or ISO 7049-ST 2.2x4.5 C or ISO 7049-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1827884 8A 160V Generic Phoenix Contact connector footprint for: MSTBV_2,5/2-GF; number of pins: 07; pin pitch: 5.00mm; Angled || order number: 1766754 12A 630V Generic Phoenix Contact SPT 2.5/3-H-5.0-EX Terminal Block, 1990821 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1990821), generated with kicad-footprint-generator ipc_gullwing_generator.py PQFP256 28x28 / QFP256J CASE 122BX (see ON Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm Footprint [HTQFP] thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP8: plastic thin shrink small outline package; 40 leads (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 transistor TO-92 2-pin leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 temperature sensor diode TO-92 horizontal, leads molded, narrow, drill 0.75mm, handsoldering variant with enlarged pads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf SSOP, 16 Pin package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf HSOIC, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, S12B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 44 Pin (http://www.ti.com/lit/ds/symlink/tpa3251.pdf#page=38), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 0.127 mm² wire, basic insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer.

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