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2.54mm 11.43mm 450mil SMDSocket LongPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead.

• 52991-0308, 30 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf.
• (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_DFN_2x3x0_9_MC_C04-123C.pdf), generated with kicad-footprint-generator connector wire 0.15sqmm double-strain-relief.
• Vertex 7.91125 -5.64888 3.26879 facet normal -4.415277e-01.
• Vertex -1.087742e+02 9.725134e+01 1.244568e+01 facet normal 0.0943295.
• -3.439695e-15 -5.206609e-15 1.000000e+00 facet normal -0.95132 0.288583.

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