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121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 8.9 mm (350 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 18-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 14-lead.

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