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Http://rohmfs.rohm.com/en/products/databook/package/spec/discrete/vml0806_tr-e.pdf MicroCrystal C3 2.5x3.7mm, https://www.microcrystal.com/fileadmin/Media/Products/RTC/Datasheet/RV-1805-C3.pdf SON, 8 Pin (JEDEC MO-241/VAC, https://assets.nexperia.com/documents/package-information/SOT764-1.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0830, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 1.5 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times.

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