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BackPitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments BGA-289, 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf USON-10 2.5x1.0mm_ Pitch 0.5mm http://www.ti.com/lit/ds/symlink/tpd4e02b04.pdf USON-10 2.5x1.0mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole pin header THT 1x19 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x03 1.00mm single row Through hole angled pin header THT 2x07 2.54mm double row Through hole angled socket strip SMD 1x33 2.54mm single row style2 pin1 right Through hole pin header THT 2x23 2.54mm double row surface-mounted straight socket strip, 2x32, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled pin header THT 1x37 1.00mm single row Through hole angled pin header, 1x10, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x32, 2.54mm pitch, single row style2 pin1 right Through hole pin header THT 2x15 2.54mm double row Through hole IDC header, 2x32, 1.00mm.
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