Labels Milestones
BackTHT DS10 4.3mm length 1.0mm diameter http://www.microcrystal.com/images/_Product-Documentation/03_TF_metal_Packages/01_Datasheet/DS-Series.pdf SMD Crystal Oscillator Seiko Epson MC-505 http://media.digikey.com/pdf/Data%20Sheets/Epson%20PDFs/MA-505,506.pdf, hand-soldering, 12.7x5.1mm^2 package SMD Crystal FC-135 https://support.epson.biz/td/api/doc_check.php?dl=brief_FC-135R_en.pdf SMD Crystal Oscillator Seiko Epson SG-8002CA https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, 7.0x5.0mm^2 package Miniature Crystal Clock Oscillator TG2520 series, https://support.epson.biz/td/api/doc_check.php?dl=app_TG2520SMN⟨=en Miniature Crystal Clock Oscillator EuroQuartz XO53 series, http://cdn-reichelt.de/documents/datenblatt/B400/XO53.pdf, hand-soldering, 5.0x3.2mm^2 package SMD Crystal EuroQuartz MT series http://cdn-reichelt.de/documents/datenblatt/B400/MT.pdf, hand-soldering, 3.2x2.5mm^2 package SMD Crystal Abracon ABM7, https://abracon.com/Resonators/abm7.pdf Abracon Miniature Ceramic Smd Crystal ABM3B http://www.abracon.com/Resonators/abm3b.pdf, 5.0x3.2mm^2 package 14-lead dip package, row spacing 7.62 mm (300 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 8x-dip-switch SPST Copal_CVS-08xB, Slide, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 2x-dip-switch SPST Copal_CVS-02xB, Slide, row spacing 15.24 mm (600 mils THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil 4-lead surface-mounted (SMD) DIP package, row spacing 6.15 mm (242 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 6x-dip-switch SPST Copal_CHS-06A, Slide, row spacing 10.16 mm (400 mils), Socket 10-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 6-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 5x-dip-switch.
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