Labels Milestones
Back4.4084x3.7594mm package, pitch 0.4mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf Lattice caBGA-381 footprint for ECP5 FPGAs, based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 10.16 mm (400 mils), Socket 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 20-pin zero insertion force socket, through-hole, row spacing 8.61 mm (338 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 10x-dip-switch SPST CTS_Series194-10MSTN, Piano, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 14-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads 22-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 15.24 mm (600 mils), LongPads 10-lead though-hole mounted.
- Electronics 9774090360 (https://katalog.we-online.de/em/datasheet/9774090360.pdf), generated with kicad-footprint-generator.
- 1.117392e+01 facet normal 0.532818 -0.8433.
- Vertex 5.13783 0.11686 18.8084 vertex 4.02158 1.16465 18.9636.
- 2x06 2.00mm double row surface-mounted straight pin header.
- 130.6675 (end 167.17 130.6675 (end.