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Socket 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 32-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 18-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 12x-dip-switch SPST CTS_Series194-12MSTN, Piano, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead.

HLE-103-02-xxx-DV-LC, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated.
0.950506 0.290244 0.110892 facet normal 0.528271 0.643697.
0.3811 vertex -5.8029 -8.06528 2.94279.
Http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic very small outline package.

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