Labels Milestones
Back(see http://www.onsemi.com/pub/Collateral/NST3906F3-D.PDF 3-pin SuperSOT package https://www.fairchildsemi.com/package-drawings/MA/MA03B.pdf 6-pin SuperSOT package http://www.mouser.com/ds/2/149/FMB5551-889214.pdf 8-pin SuperSOT package, http://www.icbank.com/icbank_data/semi_package/ssot8_dim.pdf Power MOSFET package, 3x3mm (see https://www.fairchildsemi.com/datasheets/FD/FDMC8032L.pdf Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument VSON 10 Thermal on 11 3x3mm Pitch 0.5mm LFCSP, 16.
- Normal 3.4225e-05 -0.113199 0.993572 vertex -0.948559 7.30706.
- Level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15.
- 0.000000e+00 8.032235e-01 vertex -1.048853e+02 9.695134e+01 9.319300e+00 facet.