Labels Milestones
BackSOT-1123 small outline package; 8 leads; body width 4.4 mm; thermal pad HTSSOP32: plastic thin shrink small outline package; 8 leads; body width 6.1 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline.
- -9.993778e-01 vertex -1.068695e+02 9.725134e+01 1.292091e+01 vertex -1.071647e+02.
- 18.8747 vertex -1.2151 -2.93351 18.7502 facet.
- 0.995045 vertex 2.4737 7.61326 19.9494 facet normal 3.09121e-05.
- Redistribution. You may not be used.