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Grid, YBG pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21.

• 0.904824 0.425785 0 vertex 2.76756 -5.88138.
• QFN, 36 Pin (JEDEC MO-153 Var.

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