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5A: https://gct.co/files/drawings/usb4105.pdf USB C Type-C Receptacle USB2.0 USB Type C (https://www.bulgin.com/products/pub/media/bulgin/data/Battery_holders.pdf Comfortable Electronic CR2450 battery holder, Memory Protection Devices P/N BC2AAPC, http://www.memoryprotectiondevices.com/datasheets/BC2AAPC-datasheet.pdf 2xAA cell battery holder, Memory Protection Devices P/N BC12AAPC, http://www.memoryprotectiondevices.com/datasheets/BC12AAPC-datasheet.pdf BC2003 CR2032 2032 Battery Holder BH-331P Battery Type 3xAAA Keystone Battery Holder, 2479, Battery Type C (https://www.bulgin.com/products/pub/media/bulgin/data/Battery_holders.pdf Comfortable Electronic CR2450 battery holder, Memory Protection Devices P/N BC12AAPC, http://www.memoryprotectiondevices.com/datasheets/BC12AAPC-datasheet.pdf BC2003 CR2032 2032 Battery Holder (http://www.memoryprotectiondevices.com/datasheets/BK-18650-PC2-datasheet.pdf Keystone Battery Holder, 2479, Battery Type 3xAA (Script generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-150-02-xxx-DV-A, 50 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST ACH series connector, 502585-0470 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DFN8 2x2, 0.5P; No exposed pad (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF WDFN, 12 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/APID/ProductDocuments/DataSheets/MIC2207-2MHz-3A-PWM-Buck-Regulator-DS20006470A.pdf#page=22), generated with kicad-footprint-generator Hirose DF13 through hole, DF63M-1P-3.96DSA, 1 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP56: plastic thin shrink small outline package; 44 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (http://www.st.com/resource/en/datasheet/lis331hh.pdf), generated with kicad-footprint-generator JST ZE series connector, SM06B-SHLS-TF (http://www.jst-mfg.com/product/pdf/eng/eSHL.pdf), generated with kicad-footprint-generator Hirose DF63 vertical Hirose DF13 through hole, DF11-14DP-2DSA, 7 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1530, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0013 example for new mpn: 39-29-4049, 2 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator Harwin Female Vertical Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 1x-dip-switch SPST , Piano, row spacing 6.73 mm (264 mils), body size 9.78x30.12mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 4x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), LongPads 16-lead though-hole mounted.

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