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From c9e81f0cc630cea052574ce7c50b3e82145bb626 Mon Sep 17 00:00:00 2001 Binary files /dev/null and b/Images/PXL_20210831_000922493.jpg differ Binary files /dev/null and b/3D Printing/Panels/MAGIC MISSILE VCF.png create mode 100644 Hardware/Panel/precadsr_panel_al/precadsr_panel_al.sch deleted file mode 160000 Kosmo_panel Subject: [PATCH] start From d7370bb10c83adef3d24b5bdfa6def9f11e35442 Mon Sep 17 00:00:00 2001 Subject: [PATCH] 's take on FIREBALL VCO using AD&D 1e type faces 676d1403e6 Upload files to '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels' 8de432ba4663cc4e208cff778a114b9ae41e7906 Upload files to '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/SPIDER CLIMB.png Normal file View File RadioShaek2Board.diy Executable file View File 3D Printing/Cases/Eurorack 2-Row/4c327a694daeb206e2eed537a2001b91_preview_featured.jpg Executable file View File 3D Printing/Pot_Knobs/pot_knob_two_parts_base.stl Normal file Unescape From d433f7c09a85cc6fc15536169665e257a929b9f6 Mon Sep 17 00:00:00 2001 Subject: [PATCH 02/13] More notes C10, C14 too small for a single 1.5 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.diodes.com/assets/Datasheets/AP22913.pdf WLCSP-4, 0.64x0.64mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, RWH0032A, 8x8x0.9mm (http://www.ti.com/lit/ds/snosd10c/snosd10c.pdf DFN, 10 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0429.PDF), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-123-02-xxx-DV-BE-A, 23 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator JST PUD series connector, LY20-6P-DLT1, 3 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator TE, 826576-6, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.

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