Labels Milestones
BackPitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A Artix-7 BGA, 19x19 grid, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array.
- Vertex 2.260702e-001 7.029575e+000 2.496000e+001 vertex 5.719055e+000 -4.240572e+000 9.983999e+000.
- 0.0975473 0.0975565 vertex 8.99402 -0.0606976 4.51215 facet.
- 1x35 1.00mm single row Through hole angled pin.